Product

Technical Highlights

1. Intelligent Film Debris Control and Zero-Clogging Technology – Ensuring Efficient Production Line Operation

• Technological Breakthrough: Leveraging the advanced formulas of FS-300 and WQ-2213, we have achieved precise control over the size of film debris after delamination. Whether it's moderately sized film debris or small, easily washable fragments, it completely eliminates the clogging of micropores and nozzles by dry or broken film, as well as the entanglement of rollers.

• Customer Value: Significantly reduces the frequency of production line downtime due to clogging and plate jamming, ensuring continuous and efficient operation of automated production lines (especially horizontal and spray lines), and significantly reducing manual cleaning costs.

2. Ultimate Cleanliness and AOI-Friendly Technology – Improving Inspection First-Pass Rate

• Technological Breakthrough: The entire series of chemicals possesses extremely strong penetration and stripping capabilities, achieving thorough film removal without residue for fine lines, micropores, and selectively plated products. FS-300 is further optimized for board surface cleanliness, significantly reducing "false spots" caused by residual adhesive or water stains. • Customer Value: Directly improves the accuracy of AOI (Automated Optical Inspection) testing, reduces re-judgment and false spot rejection, and provides a solid guarantee for the final quality of high-precision circuit boards.

3. Green Low Ammonia Nitrogen and Substrate Protection System – Balancing Environmental Protection and Quality

• Technological Breakthrough: FS-300 adopts a low ammonia nitrogen formula, significantly reducing the environmental pressure of downstream wastewater treatment. Simultaneously, all products (including WQ-2213/WQ-2213A) are specially fortified with highly efficient copper surface and surface treatment protectants.

Customer Value: While achieving extremely rapid film removal, it effectively avoids the attack and oxidation of exposed copper surfaces, gold plating, or OSP surface treatment layers by strong alkaline solutions, meeting the stringent environmental emission standards of modern factories while ensuring the perfect appearance and adhesion of the substrate.