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WQ-2213
Product Description
WQ-2213 Organic Film Remover is an organic film remover specifically developed for F/PCB circuit forming processes. It is also widely used for removing dry film after pattern plating and surface treatment.
Problems Solved
WQ-2213 provides an excellent solution to problems commonly encountered with traditional film removers on fine circuit boards and high-density boards, such as film trapping, incomplete removal of film from small holes, excessive film fragments clogging nozzles, and roller wrapping.
Technical Advantages
· Thorough Film Removal for Fine Circuits: Effectively reduces film trapping and incomplete removal of film from small holes, significantly improving circuit forming yield.
· Adjustable Film Fragment Size: Fast film removal speed, and the size of the film fragments can be adjusted according to actual production needs, eliminating nozzle clogging and roller wrapping, reducing equipment maintenance frequency.
· Copper Surface and Surface Protection: The formula contains a copper protectant, effectively preventing the solution from damaging the copper surface or surface-treated surfaces, ensuring product appearance and quality.