Product

Technical Highlights

• Precise Roughening, Strong Adhesion: The etching solution preferentially attacks the crystal interface, forming a uniform honeycomb-like micro-roughness surface. This ensures optimal adhesion between the copper surface and subsequent processes (such as solder resist and dry film), eliminating the risk of detachment.

• Environmental Compliance, Easy Wastewater Treatment: Key products (such as SE-400Y) are free of aromatic hydrocarbons and have extremely low COD and ammonia nitrogen levels, meeting the increasingly stringent environmental emission standards of modern PCB factories.

• Stable Performance, Wide Process Window: It exhibits excellent micro-etching stability, high copper dissolution capacity, and long bath life, effectively avoiding common problems with traditional etching solutions such as copper surface darkening and poor appearance.

• 5G High-Frequency Optimization: The SE-200M product was specifically developed to address the pain points of high-frequency communication. While ensuring adhesion, it significantly reduces intermodulation distortion (PIM) in signal transmission by optimizing the copper surface microstructure, making it the preferred choice for high-end communication board manufacturing.

Typical Application Scenarios

• Traditional PCB Manufacturing: Copper surface roughening before lamination and solder mask preparation (SE-400Y).

• High-end Communication Equipment: Suitable for fine line processing of 5G base stations and high-frequency, high-speed boards (SE-200M).

• Green Factory Construction: Suitable for modern production lines pursuing energy conservation, emission reduction, and zero emissions (DL-20 system).

• Semiconductor Industry: Suitable for precision etching of IC substrates, semiconductor packages, and displays (neutral etching solution).