Product

Technical Highlights

1. Extremely Low Surface Tension Technology – Breaking Through the Wetting Limits of High Aspect Ratio Holes

• Technological Breakthrough: Represented by SC-1010 and LFC-5001, we have significantly reduced the surface tension of the cleaning solution to below 30 dynes/cm (far lower than the 40 dynes/cm of traditional degreasing agents and the 75 dynes/cm of pure water).

• Customer Value: The extremely strong penetrating power breaks through the capillary resistance of the cleaning solution within micropores, perfectly solving the problem of bottom wetting in high aspect ratio (High TP) boards, blind vias, and micropores, completely eliminating the potential for plating resistance at the orifice opening and micro-void at the orifice bottom caused by poor wetting.

2. Intelligent Low-Fogging and Film Breakage Control Technology – Adapted to High-Speed Automated Production Lines

• Technological Breakthrough: AC-8801 and LFC-5001 employ an advanced low-foaming formulation system (e.g., LFC-5001's foam collapses within 8 seconds in shake-flask tests).

• Customer Value: Perfectly adapted to modern PCB factory horizontal spray lines and high-speed automated equipment. The extremely low foam performance avoids equipment alarms and line stoppages caused by foam overflow, while eliminating abnormalities such as film breakage, roller entanglement, and nozzle blockage, significantly reducing equipment maintenance frequency and labor costs.

3. Copper Surface Passivation Protection System – Balancing Powerful Cleaning and Substrate Safety

• Technological Breakthrough: While possessing powerful emulsification, degreasing, and particle removal capabilities, the entire series of formulations incorporates a copper surface protectant (metal corrosion inhibitor).

Customer value: While thoroughly removing oil and organic contaminants from the board surface, it effectively prevents the chemicals from causing micro-etching or oxidation attacks on exposed copper surfaces and substrates that have undergone surface treatment (such as electroless gold plating or OSP), ensuring that the adhesion of subsequent electroplating and circuit forming reaches the optimal state.