QR Code
Core Values
| Ultimate Coating Optimization Effectively enhances the brightness and smoothness of copper plating, eliminates microscopic surface defects, and facilitates the formation of a high-precision, highly consistent conductive layer. Stable and Reliable Performance The formula is highly compatible with mainstream electroplating processes, ensuring deep plating capability while maintaining good ductility and thermal shock resistance, significantly reducing the risk of wire breakage and cracking in subsequent processes. Compatible with All Manufacturing Processes Whether for ordinary through-holes, low-density circuit boards, or complex multilayer boards and high-frequency, high-speed boards, the Veggier gloss enhancer series provides targeted model support, covering the entire lifecycle from R&D to mass production. |
Technical Highlights
• Precise Formula Design: Optimizes the plating crystal structure through the synergistic effect of additives.
• Strong Process Compatibility: Perfectly adaptable to mainstream processes such as acidic copper plating and alkaline copper plating.
• Environmental Compliance: Complies with RoHS and other environmental standards, reducing environmental risks during production.
Typical Application Scenarios
• High-Density Interconnect Boards: Meets the uniformity requirements for microvia and blind via plating.
• High Aspect Ratio Through-Hole: Ensures the integrity of the plating layer on the inner wall of deep holes, preventing excessively thin copper in the holes.
• Multilayer Board Plating: Improves interlayer conductivity consistency and reliability, adapting to complex stack-up structures.
