Industry Background

Advanced packaging (such as Flip Chip, 3D IC, SiP) has extremely high cleanliness requirements. Resin, particles, and metal ions remaining after dicing, bonding, and molding processes can directly lead to solder joint failure, delamination, and signal transmission malfunctions, affecting chip reliability.

Core Solution

Provides high-cleanliness cleaning solutions for the packaging process, covering the entire process from post-die dicing cleaning, pre-wire bonding cleaning, and post-molding cleaning:

• Customized wet cleaning solutions effectively remove organic resin residues, inorganic particles, and metal ions without damaging chip pads and substrate surfaces.

• Compatible with mainstream packaging forms such as BGA, CSP, and WLCSP, meeting the requirements of advanced packaging for low defect rates and high bonding strength.

• Cleaning process compatible with automated production lines, seamlessly integrating with existing packaging equipment without significant line modifications.

Application Value

Reduces defect rates in the packaging process, improves bonding yield and molding stability, helps chips pass JEDEC reliability certification, and extends product lifespan.