Product

WQ-2213A

Product Description

WQ-2213A Organic Film Removal Accelerator is an organic accelerator specifically developed for incomplete film removal from small holes and selectively plated boards in the circuit board industry. It must be used in conjunction with KOH (potassium hydroxide) or NaOH (sodium hydroxide/caustic soda flakes) in a specific ratio.

Problems Solved

Conventional caustic soda film removal often results in incomplete removal, film fragments clogging nozzles, film fragments wrapping around rollers, and chemical attack on the copper surface when processing fine lines and high-density boards. The addition of WQ-2213A effectively overcomes these process difficulties.

Technical Advantages

· Thorough Film Removal from Fine Lines: Effectively reduces incomplete film removal from patterns or selectively plated products, significantly improving the yield of circuit formation.

· Worry-Free Film Removal from Small Holes: Precisely controls the film removal effect within small holes, avoiding subsequent defects caused by residual film in the holes.

· High Efficiency and No Residue: Fast film removal speed, producing fine film fragments, without clogging nozzles or wrapping around rollers.

· Copper surface protection: The formula contains a metal protectant that effectively prevents strong alkaline solutions from damaging the copper surface and protects the integrity of the circuit.