Industry Background

PCBs are the "skeleton" of electronic devices. The demands for PCB linewidth accuracy, via copper uniformity, and board surface cleanliness are constantly increasing in fields such as 5G, AI, and automotive electronics. Traditional process solutions are insufficient to support high-density, high-yield production.

Core Solution

Provides a high-precision PCB full-process solution system, covering key processes such as pretreatment, copper plating, electroplating, etching, and anti-oxidation:

• Adaptable to high-end PCB production such as HDI, multilayer boards, and high-frequency/high-speed boards, solving problems such as uneven blind via filling and fine line etching deviations.

• High solution stability, maintaining a long-term process window and reducing the risk of board surface oxidation and circuit defects caused by solution fluctuations.

• Customized formulations for different substrates (FR-4, PTFE, ceramic substrates) to improve copper layer adhesion and board surface flatness.

Application Value

Significantly improves PCB board yield, reduces scrap rates, and helps customers achieve stable mass production of high-density, high-reliability PCBs, meeting the stringent requirements of consumer electronics, communications, and automotive industries.