Product

SE-100

Product Description

SE-100 is a sulfuric acid-hydrogen peroxide micro-etching solution specifically developed for FPC (Flexible Printed Circuit) and PCB (Rigid Printed Circuit Board) manufacturing engineering. This product boasts excellent impurity removal capabilities, a stable micro-etching rate, and produces a uniform copper surface with a good metallic luster, making it a fundamental solution for ensuring adhesion in subsequent processes.

Core Advantages

Convenient Tank Preparation and Setup:** A wide operating window makes tank maintenance and preparation very convenient, suitable for rapid production on various production lines.

Superior Impurity Removal:** Effectively removes impurities from the copper surface, ensuring board cleanliness and providing a perfect substrate for subsequent lamination or printing.

Strong Process Compatibility:** Supports both spray and immersion (DIP) operation modes, adapting to different equipment requirements.

Environmentally Friendly and Easy to Handle:** The formula has a low COD (Chemical Oxygen Demand) content, simplifying wastewater treatment and meeting conventional environmental emission standards.

Applicable Processes

• Pretreatment: Pretreatment before lamination (including post-shadowing), pretreatment before printing solder resist (solder resist ink).

• Surface treatment: Copper surface roughening before surface treatments such as gold plating, electroless gold plating (ENIG), OSP (organic solder resist film), and tin plating.

• Special etching: Suitable for thin copper etching and medium roughening processes.