Product

SE-200M

Applicable Processes: Pre-treatment for lamination, pre-treatment for circuitry, pre-treatment for solder resist, pre-treatment for OSP.

Product Description

SE-200M is specifically developed to address the challenges of high-density circuit boards, ultra-fine lines, and microvia technology. It creates a uniform roughened surface on copper, effectively addressing the stringent requirements for intermodulation distortion (PIM) in high-frequency 5G communication. This solution preferentially attacks the crystal interface to generate roughness and is based on a sulfuric acid/hydrogen peroxide system.

Core Advantages

· 5G High-Frequency Optimization: Significantly improves PIM (intermodulation distortion) while maintaining resist adhesion, making it the preferred solution for 5G base stations and high-frequency communication boards.

· High Adhesion: Achieves high roughness (copper plating area roughness Ra value can reach above 0.2) with low micro-etching amount, ensuring strong adhesion between ink and dry film.

· Circuit Protection: No damage to fine lines; copper surface exhibits a honeycomb-like micro-roughened surface with stable micro-etching amount.

· Environmental friendliness: It also uses an environmentally friendly sulfuric acid hydrogen peroxide system, and wastewater treatment is simple.