Product

CU-200系列

The CU-200 series additives are copper plating additives for copper sulfate electroplating of circuit boards. They produce thin film products with virtually no residual stress, addressing dimensional changes caused by residual stress in flexible thin film materials. Furthermore, they exhibit excellent deposition properties with uniform electrophoretic methods, suitable for both top-plating and selective plating of flexible materials. They also handle the coexistence of blind vias in both top-plating and selective plating substrates, maintaining good TP values for both.

Features

· Extremely low residual stress

· Good electrophoretic stress

· Excellent initial deposition properties for various direct methods

· High elongation films with good thermal shock resistance

· Fine, glossy appearance

· Applicable to both insoluble and soluble anode systems

shape