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Copper Sulfate Additive CU-200 Instruction Manual
The CU-200 series additive is a copper plating additive for copper sulfate electroplating of circuit boards. It produces thin film products with almost no residual stress and can accommodate dimensional changes caused by residual stress in flexible thin film materials. Furthermore, it exhibits excellent deposition properties with uniform electrophoretic methods, suitable for both top-plating and selective plating of flexible materials. It can also handle the coexistence of blind vias in both top-plating and selective plating substrates, and both methods maintain good TP values.
Features
1. Extremely low residual stress
2. Good electrophoretic stress
3. Excellent initial deposition properties for various direct methods
4. Achieves highly elongated films with good thermal shock resistance
5. Achieves a fine, glossy appearance
6. Applicable to both insoluble and soluble anode systems
Shape
CU-200A | CU-200B |
Colorless to blue clarity | Blue color clarity |
Instructions for Use
Liquid Composition and Operating Conditions
Standard current density conditions | High current density conditions | |||
standard | scope | standard | scope | |
Copper sulfate | 100g/L | 80 ～120g/L | 150g/L | 130 ～180g/L |
sulfuric acid | 200g/L | 180 ～220g/L | 150g/L | 130 ～180g/L |
chloride ions | 50mg/L | 30 ～70mg/L | 50mg/L | 30 ～70mg/L |
CU-200A | 10ml/L | 5 ～15ml/L | 10ml/L | 5 ～15ml/L |
CU-200B | 5ml/L | 2 ～10ml/L | 5ml/L | 3～10ml/L |
Liquid temperature | 25℃ | 22～30℃ | 25℃ | 23～30℃ |
Cathode current density | 3A/dm2 | 0.1～4A/dm2 | 7A/dm2 | 3～10A/dm2 |
Electroplating Tank Setup Method
1. Add pure water to the preparation tank to 70% of its capacity, dissolving the specified amount of high-purity copper sulfate.
2. After the copper sulfate is completely dissolved, slowly add the specified amount of refined sulfuric acid while stirring, being careful to avoid overheating.
3. Add activated carbon (2-3g), stir for about 1 hour, then let it stand for 1-2 hours to allow the activated carbon to precipitate. Transfer it to the electroplating tank through a filter. Activated carbon can be replaced with YUNITIKA carbon filter cartridges (OP series).
4. Adjust the tank volume with pure water, adding appropriate amounts of hydrochloric acid or sodium chloride.
When adding 50mg/L of chloride ions: 0.125ml/L of 35% sulfuric acid, 82mg/L of sodium chloride.
5. Add the specified amount of additives, and perform dry electrolysis for 2-4 hours at a current density of 2-3A/dm².
6. Before starting the operation, it is necessary to use a plate test and CVS analysis to adjust the additive concentration.
Working conditions
When using soluble anodes | When using insoluble anodes | |
anode | Phosphorus copper plate | Titanium |
Iridium oxide surface coating | ||
Anode bag/diaphragm | Inner-textured polypropylene | Acid-resistant neutral membrane (non-ionic) |
Anode current density | 1~3A/dm2 | 1～8A/dm2 |
groove material | Acid-resistant tank (PVC or FRP) | |
Stir | Cathode braking and air agitation or jet agitation | |
filter | Continuous filtration (2-4 revolutions per hour) | |
Electrolysis consumption
standard | scope | |
CU-200A | 80ml/kAh | 25 ～120ml/kAh |
CU-200B | 120ml/kAh | 80 ～200ml/kAh |
The consumption of additives varies depending on operating conditions. During the initial tank setup, consumption increases, so the replenishment rate should be set slightly higher. Additionally, when using insoluble anodes, the consumption of B tends to increase.
Replenishment Method for Copper Salts When Using Insoluble Anodes
When using copper sulfate
Add sulfuric acid gradually as needed. (Adding 1g/L of copper sulfate increases the sulfuric acid concentration by approximately 0.38g/L). If the sulfuric acid concentration exceeds the control range,
adjust the dilution of the electroplating solution. The replenishment standard for electrolytic copper sulfate is approximately 4.7g per Ah.
When using basic copper carbonate
Because basic copper carbonate is easily dispersed and produces carbon dioxide gas, protective gear is required during use. To increase copper sulfate by 1g/L, approximately 0.45g/L of basic copper carbonate (56% Cu content) is needed. The replenishment standard for electrolytic basic copper carbonate is approximately 2.1g per Ah.
Precautions for Use
CU-200A | Insufficient current will increase the charred area and reduce uniform electrophoresis, while excessive current will cause spots to form at high current locations. |
CU-200B | Insufficient current will result in a dull or poor gloss, and there is a tendency for residual force to increase. Excessive current will cause the low-current section to become cloudy. |
Copper sulfate | When there is insufficient amount, it is easy to burn; when there is excess, the uniformity of electrobonding is poor, and copper sulfate crystals are easily formed. |
sulfuric acid | When insufficient, the uniformity of electrobonding is low; when excessive, chloride ions are abnormally consumed, making copper sulfate prone to crystallization. |
chloride ions | When the current is insufficient, the high-current section will refocus and develop spots; when the current is excessive, the low-current section is prone to fogging. When soluble anodes are used, an inert film forms on the anode surface, which hinders the dissolution of the anode and its conductivity. |
Tank temperature | Too low a current will easily cause burning. Too high a current will result in poor overall gloss, and the low current sections will easily become cloudy. |
Anode and anode bag (diaphragm) | When using soluble anodes, phosphorus-containing copper must be used, and the anode current density should be set within the range of 1–3 A/dm². Insufficient anode area will cause an increase in in-cylinder voltage and poor conductivity. Excessive anode area will increase the copper concentration, easily leading to additive consumption. Furthermore, to prevent the contamination of anode particles, an anode bag must be used. When using insoluble anodes, iridium oxide is coated into the titanium material as the insoluble anode. A diaphragm must be installed (acid-resistant neutral membrane: non-ionic). If the diaphragm is not used, the active oxygen generated from the anode will abnormally consume the additive. |
electroplating tank | Suitable for PVC, polyethylene, or FRP inner tanks. New tanks require pickling (1% sulfuric acid, 24 hours) before use. When using acid-resistant rubber inner tanks, to avoid the influence of leachate, alkaline washing (1% NaOH solution, 24 hours) is required before pickling. |
Stir | Cathode braking and air agitation or pump-assisted jet agitation Additionally, be aware of the potential for oil and other impurities to be introduced into the air agitator. |
filter | Continuous filtration (without activated carbon), filtration capacity 2-4 revolutions per hour, using an acid-resistant 5-10μm filter element. Local exhaust system A local exhaust system is required, especially when using insoluble materials, as a large amount of oxygen is generated from the anode; therefore, careful exhaust is essential. |
Wastewater Treatment
Treatment Method for Copper Sulfate Electroplating Solution
Due to its strong acidity and high copper ion content, the solution should be diluted more than 100 times with water, and the pH adjusted to above 10 with quicklime. Then, a high-molecular-weight flocculant should be added, the precipitate filtered, neutralized, and diluted to below the COD limit before discharge.
Operating and Storage Precautions
Regarding the operation and storage of A and B:
Work in a well-ventilated area with local exhaust or ventilation.
Wear goggles, a mask, rubber gloves, long shoes, and an apron during operation. Avoid mixing with strongly alkaline substances.
If it gets into eyes, immediately wash with water for 15 minutes and seek immediate medical attention.
Do not ingest or swallow. If swallowed, drink water and spit it out, then seek immediate medical attention.
Avoid skin contact. If contact occurs, immediately wash with plenty of water or warm water and soap, and seek immediate medical attention. Wash hands and rinse mouth after handling.
If spilled from the container, recover it with absorbent materials and dispose of it appropriately at another location.
Packaging
CU-200A | CU-200B |
20L/barrel | 20L/barrel |
