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CU-300 系列
The CU-300 series is a complete acidic copper plating additive system composed of a leveling agent (Agent A), a gloss agent (Agent B), and a wetting agent (Agent C). Although the products in this series have different functions, they share highly consistent physicochemical properties and safety hazards.
Product Composition and Function
This series achieves a bright, level, and pinhole-free plating effect through the synergistic effect of the three components.
Component Name | model | Core Functions | Main components of the document |
leveling agent | CU-300A | Inhibitors refine crystals and prevent roughness. | Sulfuric acid, polyethylene glycol, water |
Gloss | CU-300B | Accelerators speed up deposition and produce a glossy finish. | Sulfuric acid, copper sulfate, water |
wetting agent | CU-300C | Eliminate hydrogen bubbles, prevent pinholes, and reduce tension. | Sulfuric acid, polyethylene glycol, water |
Physicochemical Properties
The CU-300 series shares the following common physical properties:
• Appearance and properties: Pale blue liquid with a distinctive odor.
• pH value: Not specified (but based on the presence of sulfuric acid, it is presumed to be strongly acidic).
• Specific gravity: Approximately 0.988 (based on water=1).
• Solubility: Completely soluble in water.
