Product

LFC-5001

Product Description

LFC-5001 is a low-foaming, low-surface-tension acidic degreaser developed by Wechner Electronics specifically to solve challenging high-end PCB electroplating processes.

This product is specifically designed for complex processes such as high TP (aspect ratio) copper plating, blind via plating, through-hole copper plating, and selective copper plating. Its core advantage lies in its extremely strong wetting ability, effectively penetrating to the bottom of the via, resolving defects such as voids and micro-voids caused by insufficient wettability of the solution, significantly improving the integrity and reliability of the plating layer.

Key Features

00001. Extremely Low Surface Tension:

· At 25°C, the surface tension is only 30 dynes/cm (traditional acidic degreasers typically have 40 dynes/cm, and pure water has 75 dynes/cm).

· Provides an excellent HLB (hydrophilic-oleophilic balance) value, ensuring complete wetting of the micro-hole walls.

00002. Ultra-Low Foaming Characteristics:

· At 25℃, foam collapses within 8 seconds in a 300ml shake-flask test.

· Extremely suitable for spray and horizontal production lines, preventing foam accumulation from affecting production.

00003. Defect Repair Capability:

· Effectively overcomes the problem of plating voids in high aspect ratio holes, improving first-pass yield.

Applicable Processes

Focusing on horizontal copper plating lines and high-end HDI board processes with extremely high requirements for hole wettability and cleanliness. Specifically including:

· High aspect ratio (High TP) copper plating process: Solves the pain points of difficult wetting and difficult chemical penetration in deep holes of thick boards.

· Blind hole copper plating process: Ensures effective cleaning and wetting of the bottom of small blind holes.

· Through-fill copper plating process: Ensures no air bubbles remain in the holes during through-filling pretreatment, improving through-filling quality.

· Selective copper plating process: Provides precise cleaning and activation pretreatment in localized copper plating processes.